An all-in-one positioning and reballing setup for A13 CPU lower-layer work. The 0.12 mm steel stencil features a half-etched design and a tin-blocking pattern for controlled solder-ball placement.
Key Features
0.12 mm A13 CPU lower-layer steel stencil with half-etched design.
Integrated A13 positioning plate and magnetic base for bench setup.
Two No. 46 scraping blades shown in the kit image.
Product Specifications
Brand: AMAOE
Application: A13 CPU lower-layer reballing
Stencil thickness: 0.12 mm
Stencil design: Half-etched, tin-blocking pattern
Package Includes
1 × A13 CPU lower-layer 0.12 mm steel stencil (half-etched design)
1 × A13 integrated positioning plate
1 × magnetic base
2 × No. 46 scraping blades
Target Applications
A13 CPU lower-layer solder reballing in board-level phone repair.
