An integrated positioning and reballing kit for A17 CPU lower-layer work. Its 0.12 mm steel stencil features a half-etched design for solder-ball placement during board-level repair.
Key Features
0.12 mm A17 CPU lower-layer steel stencil with half-etched design.
A17 integrated positioning plate and magnetic base for a steady bench setup.
Two tin scraping blades shown in the kit image.
Product Specifications
Brand: AMAOE
Application: A17 CPU lower-layer reballing
Stencil thickness: 0.12 mm
Stencil design: Half-etched
Package Includes
1 × A17 CPU lower-layer 0.12 mm steel stencil (half-etched design)
1 × A17 integrated positioning plate
1 × magnetic base
2 × tin scraping blades
Target Applications
A17 CPU lower-layer solder reballing in board-level phone repair.
