An integrated positioning and reballing setup for A19 and A19 Pro CPU lower-layer work. Choose either the half-etched or through-etched version to suit your repair process. Each version includes two model-specific 0.12 mm steel stencils.
Key Features
Separate A19 and A19 Pro CPU lower-layer stencils in the selected version.
Choice of half-etched or through-etched stencil design.
Shared A19/A19 Pro positioning plate and magnetic base for bench setup.
Product Specifications
Brand: AMAOE
Application: A19 and A19 Pro CPU lower-layer reballing
Stencil thickness: 0.12 mm
Available versions: Half-Etched or Through-Etched
Package Includes (Per Selected Version)
1 × A19 CPU lower-layer 0.12 mm steel stencil, in the selected design
1 × A19 Pro CPU lower-layer 0.12 mm steel stencil, in the selected design
1 × A19/A19 Pro integrated positioning plate
1 × magnetic base
2 × tin scraping blades
Choose your version: The Half-Etched option includes two half-etched stencils; the Through-Etched option includes two through-etched stencils. These are separate purchase options, not four stencils in one kit.
Target Applications
A19 and A19 Pro CPU lower-layer solder reballing in board-level phone repair.
