Choose the stencil option that matches your repair work. These reballing stencils are designed for applying solder paste to compatible mobile phone chips during BGA repair.
Key Features
Stencil options for mobile CPU and IC reballing
Choose from CG4-48 global kit, HUAWEI full range, XIAOMI Mi1–17 full range, or IP6–17 series with CPU
Helps align solder paste with chip pad patterns
Product Specifications
Brand: AMAOE · Product type: BGA reballing stencil · Available options: CG4-48 global kit / HUAWEI / XIAOMI Mi1–17 / IP6–17 with CPU
Package Includes
The selected stencil option only. Contents vary by option; check your selection before ordering.
Target Applications
Mobile phone CPU and IC reballing. Confirm chip pattern and stencil compatibility before use.
