Clean up heavy solder joints, bridged pins, and flooded PCB pads in seconds. The HMT-3015 HuiMinTong Desoldering Wick (X300 Series) is crafted from premium pure copper wire woven in a flat-needle braid structure. Its soft, flexible design conforms tightly to pads and component leads, conducting heat rapidly from your iron tip to draw molten solder away like a sponge. Engineered for reliability, it delivers rapid tin absorption, leaves minimal residue, and prevents board damage during delicate rework.
Key Features & Performance Advantages
Rapid Solder Absorption: Precision-woven pure copper flat braid draws molten solder instantly out of through-holes, large joints, and component pads in a single sweep.
Fast Heat Conduction: Optimized thermal conductivity ensures fast melt and flow, minimizing iron contact time to protect delicate PCB traces and heat-sensitive SMD components.
Anti-Static & ESD Safe: Safe for static-sensitive electronics, IC boards, and motherboard repair.
Low Residue & Non-Corrosive: Delivers clean, bright solder points with minimal non-corrosive residue, keeping post-clean time to a minimum.
Oxidation & Corrosion Resistant: Treated surface resists oxidation during heating for consistent tin pickup from start to finish.
RoHS Compliant & Eco-Friendly: Manufactured to environmental safety standards for clean bench work.
Recommended Applications
Desoldering larger through-hole pins, power connectors, switches, and electrolytic capacitors
Clearing stubborn solder bridges on ICs, SMD chips, and dense PCB layouts
Absorbing excess solder and leveling pads during BGA pad preparation and motherboard repair
General electronics maintenance, soldering corrections, and workshop prototyping
Available Pack Options
1 Roll: Ideal for single-bench testing or occasional repairs
5 Rolls: Cost-effective bundle for active technicians and repair desks
10 Rolls: Best-value multi-pack for repair shops, assembly lines, and high-volume workshops
How to Use
Place a fresh section of the 3.0mm braid over the solder joint or excess solder you want to remove.
Press your heated soldering iron tip firmly against the top of the wick.
Hold briefly until the solder melts and wicks up completely into the copper braid.
Lift both the iron tip and the wick off the board simultaneously to avoid sticking.
Snip off the saturated section of wick with flush cutters, ready for the next joint.
Specifications
Brand: HuiMinTong (惠民通)
Model: HMT-3015 (X300 Series)
Material: Pure copper flat-needle braid
Width: 3.0 mm
Length: 1.5 m per roll
Compliance: RoHS compliant, ESD safe
Available Quantities: 1 Roll, 5 Rolls, 10 Rolls
Who It's For
An indispensable consumable for smartphone technicians, laptop and motherboard repair specialists, electronics engineers, and DIY hobbyists. Keep fresh rolls on hand at every workstation to clear solder bridges and component pins quickly and cleanly.
