Ice-Core Thermal Conductive Gel – Move Heat Out, Keep Performance In
Hot spots on a CPU, GPU, or power stage silently steal performance and shorten component life. HMT-G009 Ice-Core Thermal Conductive Gel bridges the microscopic gap between a hot chip and its heatsink, so heat flows out fast and components stay cool under sustained load. Whether you are rebuilding a laptop, refreshing a desktop build, or servicing LEDs and power boards, this gel gives you a clean, reliable thermal interface you can count on.
Three Grades for Three Jobs
HMT-G009 is available in three thermal conductivity levels, so you can match the interface to the workload:
4.0 W/m·K – dependable everyday cooling for office PCs, notebooks, and general electronics repair
6.0 W/m·K – high-performance interface for gaming builds, workstations, and hot-running chipsets
8.5 W/m·K – flagship-grade transfer for CPUs and GPUs under sustained heavy load, LED modules, and power electronics
Why You'll Reach for It on Every Repair
Smooth gel consistency spreads thinly and evenly, filling microscopic surface gaps for full contact between chip and heatsink
One tube, many boards – ideal for phone, laptop, console, and desktop repair benches where thermal compound is used daily
Clean application – the gel holds its shape during application, so there is less mess and less waste than runny pastes
Long-term stability – formulated for a durable thermal interface that keeps working after the repair leaves your bench
How to Apply
Clean the old compound from the chip and heatsink surface.
Apply a small, even layer of HMT-G009 to the center of the chip.
Mount the heatsink evenly – the pressure spreads the gel into a thin layer.
Power on and check temperatures; a thin layer performs best.
Applications: CPU, GPU, chipset, LED modules, power boards and other electronic cooling interfaces
Who It's For
A must-have for repair technicians, PC builders, and electronics enthusiasts. Stock the grade that matches your typical jobs, or keep all three on the shelf for everything from routine laptop cleanups to high-power rebuilds.
Tip: match the grade to the heat load – higher conductivity for hotter-running components gives the best temperature results.
