Skip to product information
1 of 15

HMT-X1 220V US Standard Motherboard Layer Separation & Glue Removal Heating Station

HMT-X1 220V US Standard Motherboard Layer Separation & Glue Removal Heating Station

Regular price ¥168.00 CNY
Regular price Sale price ¥168.00 CNY
Sale Sold out
Taxes included.

HMT-X1 Multi-Function Motherboard Layer Separation & Glue Removal Heating Station (220V US Standard)

The HMT-X1 Multi-Function Heating Platform by HuiMinTong is an advanced preheating and rework station engineered for precision electronics repair. Designed for double-layer logic board separation, underfill adhesive degumming, and chip desoldering, it features a microcomputer digital thermostat and precision mechanical clamping system to deliver stable, uniform heat without thermal damage to delicate motherboard components.

Key Features

  • Microcomputer Digital Temperature Control: Built-in intelligent thermostat with a high-clarity 3-digit LED digital display provides real-time temperature monitoring and precise thermal control for safe, consistent soldering and desoldering.
  • Dual Layer Separation & Glue Removal Design: Purpose-built for separating sandwich-structure mobile phone and computer motherboards, as well as cleaning edge glue, underfill, and resin around CPUs, basebands, and NAND flash chips.
  • Precision Rotary Clamping Mechanism: Dual-knob bilateral mechanical clamps securely lock motherboards and irregular PCB boards in place, preventing shifting or warping under heat.
  • Fast & Uniform Thermal Conduction: High-efficiency heating plate ensures rapid temperature ramp-up and balanced heat distribution across the entire working surface, eliminating cold spots.
  • Integrated Auxiliary Work & Preheating Area: Equipped with dual rotating locking levers on the rear platform to stabilize workpieces, preheat auxiliary boards, or organize tools during complex operations.
  • Standard 220V US-Plug Configuration: Complete with a heavy-duty, heat-resistant detachable power cord configured for 220V US standard power outlets.

Product Specifications

  • Model: HMT-X1 (ZJ-X1)
  • Brand: HuiMinTong (HMT)
  • Operating Voltage: 220V AC (US Standard Plug)
  • Thermostat Type: Microcomputer digital thermostat with LED display
  • Primary Functions: Motherboard layering / splitting, glue removal, BGA preheating
  • Fixture Type: Rotary precision screw clamp with dual auxiliary locks
  • SKU: 112137-01

Package Includes

  • 1 × HMT-X1 Multi-Function Layered Heating Station
  • 1 × 220V US Standard Power Cable
  • 1 × User Manual

Target Applications

Ideal for professional smartphone motherboard repair centers, computer technician workstations, BGA rework labs, and micro-soldering training facilities.

Product features

Materials and care

Merchandising tips

View full details
Your cart
Product Product subtotal Quantity Price Product subtotal
HMT-X1 220V US Standard Motherboard Layer Separation & Glue Removal Heating Station
HMT-X1 220V US Standard Motherboard Layer Separation & Glue Removal Heating Station112137-01
HMT-X1 220V US Standard Motherboard Layer Separation & Glue Removal Heating Station112137-01
¥168.00/ea
¥0.00
¥168.00/ea ¥0.00