HMT-850 Hot Air Gun Extended Curved Desoldering Nozzle

HMT-850 Hot Air Gun Extended Curved Desoldering Nozzles

The HMT-850 Hot Air Gun Desoldering Nozzle Series is engineered for precision micro-soldering, SMD rework, and BGA chip repairs. Crafted from premium high-temperature resistant stainless steel with a standard 24mm screw-locking clamp, these nozzles deliver concentrated, leak-free airflow while providing an unobstructed line of sight under stereo microscopes.

Key Features

• Unobstructed Microscope View: Extended curved and angled configurations bypass heat gun bulk and tall board components, offering clear visual access and ergonomic clearance during intricate PCB soldering under a microscope.
• Premium Heat-Resistant Stainless Steel: Precision-molded from heavy-duty industrial stainless steel that withstands continuous high temperatures without thermal deformation, oxidation, or slagging.
• 360° Secure Screw Clamp: Features an integrated 24mm adjustable collar with a dedicated locking screw and nut, ensuring a tight, drop-resistant fit and zero hot air leakage across 850-style rework station handles.
• Concentrated & Uniform Airflow: Seamless, smooth-bored interior design channels air efficiently to target specific solder joints, ICs, and small SMD components without overheating adjacent heat-sensitive parts.
• Versatile Nozzle Configurations: Available in Long-Bent, Short Angled, Special-Shaped Angled, and Straight profiles with 3mm, 5mm, 8mm, and 10mm diameters to tackle diverse rework challenges.

Product Specifications

• Brand: HuiMinTong (HMT)
• Model: HMT-850 Series
• Mount Interface Diameter: 24mm (Standard 850 heat gun barrel mount)
• Locking Mechanism: Adjustable screw clamp with locking nut
• Material: Industrial-Grade High-Temperature Stainless Steel
• Configurations & Sizes:
  • Long-Bent (Extended Curved 100mm / 103mm): 3mm (11.3g), 5mm (13.4g), 8mm (16g)
  • Straight (45mm): 3mm (9.3g), 5mm (9.8g), 8mm (10g), 10mm (11.2g)
  • Short Angled (44mm, 45° Bevel): 3mm (9.7g), 5mm (10.1g), 8mm (10.8g), 10mm (11.8g)
  • Special-Shaped Angled (53mm): 5mm (10g), 8mm (11g), 10mm (11.4g)
• Package Dimensions: 82mm × 120mm
• Compatibility: Compatible with 850, 850A, 852, 852D+, 950, and standard 850-type hot air rework stations

Package Includes

• 1 × HMT-850 Hot Air Gun Nozzle (Selected Specification)

Target Applications

Ideal for smartphone logic board repair, laptop motherboard BGA desoldering, SMD reflow soldering, component replacement under microscopes, and high-precision electronics rework.