An all-in-one positioning and reballing setup for A14 CPU lower-layer work. The 0.12 mm steel stencil uses a half-etched design for solder-ball placement during board-level repair.
Key Features
0.12 mm A14 CPU lower-layer steel stencil with half-etched design.
Integrated A14 positioning plate and magnetic base for a stable bench setup.
Includes two No. 46 scraping blades shown in the kit image.
Product Specifications
Brand: AMAOE
Application: A14 CPU lower-layer reballing
Stencil thickness: 0.12 mm
Stencil design: Half-etched
Package Includes
1 × A14 CPU lower-layer 0.12 mm steel stencil (half-etched design)
1 × A14 integrated positioning plate
1 × magnetic base
2 × No. 46 scraping blades
Target Applications
A14 CPU lower-layer solder reballing in board-level phone repair.
