An integrated positioning and reballing kit for A15 CPU lower-layer work. Its 0.12 mm steel stencil uses a half-etched design for solder-ball placement during board-level repair.
Key Features
A15 CPU lower-layer 0.12 mm steel stencil with half-etched design.
Integrated A15 positioning plate and magnetic base for bench setup.
Two scraping blades shown in the kit image.
Product Specifications
Brand: AMAOE
Application: A15 CPU lower-layer reballing
Stencil thickness: 0.12 mm
Stencil design: Half-etched
Package Includes
1 × A15 CPU lower-layer 0.12 mm steel stencil (half-etched design)
1 × A15 integrated positioning plate
1 × magnetic base
2 × tin scraping blades
Target Applications
A15 CPU lower-layer solder reballing in board-level phone repair.
