Achieve clean, reliable solder joints every time with HMT-Y047 BGA Solder Paste. Specially formulated for micro-soldering, BGA rework, and surface-mount technology (SMT/SMD) repairs, this solder paste delivers smooth dispensing, excellent wetting, and superior thermal conductivity. Whether you are reballing chipsets on smartphones, repairing laptops, or assembling fine-pitch circuit boards, HMT-Y047 ensures bright, defect-free solder connections without bridging or voiding.
Why You'll Reach for It on Every Repair
High-Activity Flux Medium – Rapidly removes oxidation from copper pads and component leads, promoting immediate wetting and strong capillary action.
Fine & Uniform Particle Size – Formulated with uniform micro-alloy particles for smooth stencil printing and syringe dispensing without clogging fine apertures.
Bright & Shiny Solder Joints – Melts cleanly under hot air or reflow, forming full, mechanically robust solder joints with low voids and high electrical conductivity.
Anti-Bridging & Low Slump – Maintains shape during preheat to prevent solder balling, bridging, and accidental shorts between tightly spaced pins.
Minimal, Non-Corrosive Residue – Leaves a light, non-corrosive residue that won't damage board traces; easily cleaned with PCB cleaner or isopropyl alcohol (IPA).
How to Use
Clean the PCB: Thoroughly clean the target pads and remove any old oxidized solder, flux residue, or dust.
Apply Paste: Dispense or squeegee HMT-Y047 solder paste evenly across pads or through your BGA reballing stencil.
Heat & Reflow: Apply heat evenly using a hot air rework station or reflow plate until the paste fully melts and forms shiny solder joints.
Cool & Clean: Allow the board to cool naturally; clean any remaining flux residue with isopropyl alcohol (IPA) or flux remover for a pristine finish.
Specifications
Model: HMT-Y047
Product Type: BGA Solder Paste
Brand: HuiMinTong (HMT)
Applications: BGA reballing, SMD/SMT rework, smartphone and laptop logic board repairs, fine-pitch IC soldering, component replacement
Residue: Low-residue, non-corrosive, cleanable with IPA
Who It's For
An essential consumable for micro-soldering specialists, electronics repair technicians, mobile phone motherboard technicians, and SMD hobbyists. Pair HMT-Y047 with precision stencils and a hot air rework station to make tough BGA reballing jobs fast, clean, and repeatable.
Storage & Handling Tip: Store sealed in a cool, dry place. For optimal dispensing and wetting performance, allow refrigerated paste to return naturally to room temperature before opening and using.
