Upgrade your micro-soldering and SMD rework bench with the HMT-Y048 BGA Solder Paste. Available in both Milky-White and Pale Yellow formulations, HMT-Y048 gives technicians the perfect consistency and activity level for delicate electronics repairs without voiding or bridging.
Why You'll Reach for It on Every Repair
Dual Formulation Options – Choose between Milky-White (ultra-clean, low-residue formula for fine-pitch ICs) and Pale Yellow (high-activity formula for rapid deoxidation and smooth alloy flow).
High-Activity Wetting Medium – Instantly cuts through heavy surface oxides on copper pads, BGA pads, and component pins, promoting immediate capillary action and shiny solder flow.
Smooth, No-Spatter Consistency – Blended for even dispensing from syringes or dispensing bottles; heats cleanly without spitting, bubbling, or dislodging micro-components under hot air rework.
Anti-Bridging & Low Slump – Holds its shape during preheat cycles to prevent solder balls, accidental bridges, and unwanted shorts between closely spaced BGA ball grids.
Non-Corrosive, Easy-Clean Residue – Leaves behind a mild, non-conductive residue that will not corrode copper traces; easily cleaned with PCB cleaner or isopropyl alcohol (IPA).
How to Use
Clean the Board: Remove oxidized solder, dust, and old flux residue from the target area using PCB cleaner or IPA.
Apply Paste: Dispense a thin, even coat of HMT-Y048 onto the BGA pads or apply directly through your reballing stencil.
Heat & Reflow: Use a hot air rework station or reflow plate to heat the component until the solder flows smoothly into bright, well-formed spheres or joints.
Cool & Clean: Allow the board to cool naturally. Wipe away any excess residue with isopropyl alcohol for a clean, inspection-ready finish.
Applications: BGA reballing, SMD/SMT rework, smartphone and laptop motherboard repair, CPU/GPU chipset re-soldering, fine-pitch IC rework
Residue: Mild, non-corrosive, easily cleanable with IPA or board wash
Who It's For
An indispensable bench consumable for phone repair specialists, laptop motherboard technicians, SMD rework operators, and precision electronics hobbyists. Combine HMT-Y048 with direct-heat stencils, hot air stations, or micro-soldering irons for reliable, repeatable results on every job.
Storage Tip: Keep container tightly sealed in a cool, dry place away from direct sunlight. Allow sealed paste to stabilize at room temperature prior to use for consistent dispensing performance.
