When a phone runs hot after a board repair, the gap between the CPU shield and the heat spreader is usually the culprit. These HuiMinTong Phone CPU Thermal Copper Sheets fill that gap. Each shim is pure copper, cut clean at 12.4 x 14 mm, so it drops straight onto a phone CPU area without trimming. Copper moves heat far faster than a pad alone, so the chip sheds warmth into the frame instead of holding it.
Three thicknesses let you dial in the stack height: 0.1 mm for a tight shim, 0.3 mm for the usual gap, and 0.5 mm when you need real fill. Every case holds 50 pieces, enough for a long run of repairs.
Why You'll Like It
Fast Heat Transfer - solid copper pulls heat off the CPU and spreads it out.
Ready-Cut Size - 12.4 x 14 mm sheets need no cutting or filing.
Three Thicknesses - 0.1, 0.3 and 0.5 mm to match the gap you are filling.
50 Pieces Per Case - bench-friendly quantity in a clear snap-lid box.
Thin And Flat - stacks neatly under shields and heat spreaders.
Made For
Phone and tablet CPU thermal repair
Filling gaps between chip and heat spreader
Board-level and digital device rework benches
Specifications
Brand: HuiMinTong
Material: copper
Sheet Size: 12.4 x 14 mm
Thickness Options: 0.1 mm, 0.3 mm, 0.5 mm
Quantity: 50 pcs per case
In The Box
50 x copper thermal sheets (thickness as selected)
1 x clear storage case
Note: manual measurement may have a slight error. Please refer to the actual product for exact dimensions.
