The HMT Quick 861DW Hot Air Gun Nozzle Series is precision-engineered for professional SMD rework, BGA desoldering, and micro-soldering repairs. Built from heavy-duty high-temperature stainless steel with an exact 23mm mounting base, these nozzles ensure seamless compatibility with Quick 861DW stations, delivering concentrated, leak-free airflow and an unobstructed view under stereo microscopes.
Key Features
Unobstructed Microscope View: Angled and 45-degree nozzle designs bypass the bulk of the heat gun handle, giving technicians an open, clear line of sight under microscopes during delicate board repairs.
Heat-Resistant Real Steel: Constructed from premium industrial stainless steel that withstands continuous high temperatures without thermal deformation, oxidation, or slag formation.
Precision Leak-Free Fit: Designed with a precision 23mm base diameter for instant swap and a secure, tight seal that eliminates air leakage on Quick 861DW and compatible rework handles.
Concentrated & Stable Airflow: Precision-formed air channels focus heat directly onto target ICs, BGA chips, and SMD pads without thermal drift or overheating adjacent components.
Comprehensive Configurations: Available in Straight, Angled, and 45° Angled profiles with sizes ranging from 3mm to 12mm to meet every micro-soldering and reflow requirement.
